Direct Wafer Technology™

Current wafer manufacturing is a multi-step, energy- and capital-intensive process that limits cell efficiency potential for manufacturers due to bulk quality defects that emerge in the wafer growth process.

Direct Wafer Process

About the Process

Direct Wafer™ is a one-step, kerfless wafer-making process that has the potential to revolutionize wafer manufacturing. By delivering higher quality “drop-in” replacement multicrystalline wafers with unique surface features, 1366’s Direct Wafer technology forms a standard, 156mm multi-crystalline wafer directly from molten silicon.

The semi-continuous, high-throughput process eliminates silicon waste, resulting in a more powerful, low-cost wafer.

Direct Wafer™ Timeline