1366 Technologies Introduces 3D Wafer Feature

Company Demonstrates Unique Capabilities of the Direct Wafer® Process to Grow Thin Wafers with Thick Border Bedford, MA — August 16, 2016  1366 Technologies (1366) today unveiled the first of a series of R&D achievements that have the potential to change the way the solar industry thinks about wafer features. The company’s proprietary Direct Wafer® process…