Company Demonstrates Unique Capabilities of the Direct Wafer® Process to Grow Thin Wafers with Thick Border Bedford, MA — August 16, 2016 1366 Technologies (1366) today unveiled the first of a series of R&D achievements that have the potential to change the way the solar industry thinks about wafer features. The company’s proprietary Direct Wafer® process…
Partnership Establishes Long-Term Silicon Supply Agreement and Initiates Technical Collaboration Between the Two Companies; Includes $15M Equity Investment in 1366 Bedford, MA and MUNICH June 28, 2016 Silicon wafer manufacturer 1366 Technologies (1366) and Wacker Chemie AG (Wacker) (ETR: WCH) today announced that they have formed a long-term strategic partnership that is expected to accelerate growth…
The Direct WaferÂ® process opens up several feature options that are not possible with conventional manufacturing. These features will revolutionize how the industry thinks about wafer specifications.
The Direct WaferÂ® process eliminates the low-quality â€œtail,â€ and cuts SKUs and inventory costs.
The more uniform, darker appearance of 1366â€™s wafers is attractive to customers.